All our engineers are highly trained electronic specialists, capable of reading schematics and performing logic board repairs down to the component level. While many service centers claim to offer component-level repairs, they often don’t explain the different levels involved. For example:

• Level 1: MagSafe / Fuse Replacement
• Level 2: Power IC Replacement (6-12 pin ICs)
• Level 3: Controller IC Replacement (200-400 pin ICs)
• Level 4: BGA Rework / Reflow (Northbridge / Southbridge / Graphics Chips)
• Level 5: BGA Reballing

Unlike many other repair centers, our engineers are fully trained to handle repairs up to Level 5. We currently have three state-of-the-art infrared BGA rework/reflow units, along with advanced equipment for reballing BGA chips. With cutting-edge technology at our disposal, we are far better equipped than our competitors to address common SMC (System Management Controller) and GPU issues—especially as Apple integrates higher-end chips, which come with increasing failure rates.